The characteristics and advantages
1. 300 mm * 300 mm big measurement area, fully meet the requirements of the base plate
2. Real programmable test system
3. Look for automatically by the PCB MARK position and correct the OFFSET
4. A key, multiple objective measurement
5. Automatic compensation correction base plate buckling deformation, obtain accurate height of solder paste
6. Strong SPC data statistical analysis software
7. Can alert, can automatically generate X - BAR, R - CHART, histogram, the histogram, etc
8. Scan imaging section slices can be measurement and analysis, color image also can be used in 2 d
9. The precise and reliable hardware system, can provide reliable test precision and reliable service life
10. Beyond the solder paste thickness test multifunctional test
Repeat accuracy
Measurement speed: 60 profiles/s
Height measurement range: 5-500 um
Resolution: 0.5 um
Repetitive error: height is less than 1.2 um, volume is less than 1% (based on the 3 sigma method guarantee)
X, y axis movement range: 300 mm * 300 mm (auto)
X, y axis precision: 0.25 um
The machine configuration
Standard UP3500 system, including the following parts:
Laser measurement system:
1. The laser system
2. Optical detection system
3. The computer control system
4. System installation backup floppy disk
5. The standard height and calibration certificate (local production, in accordance with local standard)
6. Operation manual (Germany, Britain, the selection of a)
options
1. The embedded SPC data processing system
2. The GR&R system assessment tools